Top Reasons People Use Liquid Nitrogen for Thermal Test Cooling

Top Reasons People Use Liquid Nitrogen for Thermal Test Cooling

Thermal testing can be time consuming. Getting it done in a reliable, verifiable way using less time means less costs.

 

Thermal Platforms heat and cool with conduction which is inherently faster than with convection in a temperature chamber.

 

 

Coolant choices are detailed elsewhere in the TotalTemp Blogs but to make a long story short, The main prevailing cooling choices are – Refrigeration compressors and expendable refrigerants ie. Liquid Carbon Dioxide (CO2) and Liquid Nitrogen(LN2).

 

Liquid Nitrogen has the ability to provide the fastest ramp rates and achieve the coldest temperatures. Temperatures down to -100ºC or colder are achievable with ramp rates over 50ºC per minute.  Typically the full range is not needed but in the event that future testing requires yet colder temperatures it is good to have the capability built in and not have to replace equipment.

 

LN2 systems are far simpler than refrigeration systems with many less ways they can fail.

LN2 cooling uses very little power so no special electrical services or usage costs are involved.

 

In my experience, LNdelivered through a distribution system can have it’s issues but is often less troublesome than CO2 distribution systems. CO2 systems can sometimes have blockage issues revolving around 1) Water intrusion and 2) the physical property of CO2‘s triple point.  Triple point is the temperature and pressure where CO2 can exist as liquid gas and solid. For CO2, this occurs at a relatively low pressure resulting in the possibility of coolant becoming solid (dry ice) in the delivery line or elsewhere besides the point of use.

 

Mechanical refrigeration systems are initially considerably more expensive than expendable coolants and in often in the long run are more expensive than expendable coolants when electricity usage and maintenance is included in the equation.  Mechanical refrigeration is also far more complicated and expensive when temperatures below -35º or -40ºC are required.  Modern refrigeration systems to achieve testing temperatures below -40 have evolved considerably but they are still extremely complicated more expensive and prone to requiring service.

 

I’d like to end on a positive note but first it would be fair to address the down side as I see it for using LN2 as a coolant. When smaller scale usage is the case, portable tanks make more sense, changing tanks out can be a nuisance but if usage is greater, a distribution systems would be in order. Distribution systems are fairly expensive,  typically much more than $100/linear foot.  Since LN2 is so incredibly cold, about -185ºC vacuum jacketed insulation is required to reduce losses.  There will always be some losses in the delivery line with small or large LN2systems. Finally the biggest concerns with LN2 is the recommendation for an automated LN2 shut off valve to prevent run-away cooling in the event of a valve sticking open.

 

As an alternative to LN2 distribution systems, there are distribution systems using liquid COthat are designed with the ability to distribute the coolant through an uninsulated small diameter line thus reducing losses. Makers of CO2 distribution systems claim significant economy over LN2 delivery systems. However as a down side, a single refrigeration compressor must run to condense the coolant into a reservoir above the points of use.

 

So the the Top Reasons to use Liquid Nitrogen are 1) Speed of cooling, 2) Temperature range, 3) Low initial cost and 4) Favorable long term costs 5) Superior reliability.

 

As a manufacturer of thermal testing products, the majority of our requests are for LNcooled systems. Equally we offer CO2 cooled or mechanical refrigeration systems. We endeavor to help customers acquire the systems that best fill their testing requirements.

 

Call or email us now with any questions regarding your thermal testing

Temperature Chamber Choices

Temperature Chamber Choices

Thermal testing of products can’t be ignored. Knowing your product stands up to the harshest environments it will be exposed to over the life of the product provides proof of the design and verified quality. With TotalTemp Temperature Chambers and Thermal Platforms, you can most effectively run thermal tests for burn-in or design/production verification. Products meant for consumers have to be tested, but it’s safe to say, products going into space need far more rigorous verification. Life tests or inappropriate tests can go too far, thus shortening the life so it is important to ensure the proper testing is performed. Optimum prior testing must be done when your product is meant to be catapulted into orbit.  TotalTemp products are made with the highest quality because you need precise and repeatable results.

TotalTemp led the way when it announced the first true Hybrid Temperature Chamber/Thermal Platform Combination HBC (Hybrid Benchtop Chamber). TotalTemp’s Hybrid Benchtop Temperature Chamber provides the benefits of both a temperature chamber and platform. The Hybrid Temperature Chamber brings innovation to the thermal testing arena in being the first to combine chamber and platform capabilities. The chamber floor can be set to either hot or cold and runs independently or simultaneously with the chamber. The Hybrid Temperature Chamber comes in micro, small and medium thermal chambers. The smaller form factor and updated technology of the HBC series of temperature chambers have afforded many performance improvements.

The cycle time has been greatly reduced, and there has been a great reduction in the thermal gradients once a setpoint is achieved. The design philosophy has created an easy-to-use unit with easy access to the DUT – through the hinged lid or front door and provides phenomenal speed and thermal uniformity. The HBC utilizes power efficiently, lowering its environmental and power requirement impact. The decreased footprint of the Hybrid Temperature Chamber effectively uses lab space. Its efficiently designed user interface and automation features help get the testing done in the shortest amount of time.

The HBC system can even be purchased separately as a shroud to upgrade your existing thermal platform. TotalTemp also offers the next generation of custom-designed thermal testing equipment. The details of the chambers can be modified according to your specific needs. Examples include the new Custom Side Flow Chamber which allows for seamless integration into externally mounted racks.

TotalTemp’s Dual Channel Synergy Nano Temperature Controller allows you to control chambers & platforms independently or simultaneously. TotalTemp also makes larger benchtop easier with the new SD288-N. The SD288-N provides 288 square inches (12” x 24”)  of area for thermal testing while still having a smaller footprint than a benchtop thermal chamber.

The Dual Mode system allows for improved temperature cycling by combining convection and conduction for heat transfer. There are many types of thermal chambers, and TotalTemp can work with your individual requirements. All TotalTemp temperature chambers are reliable and provide you the confidence to know your tests meet the required standards. The equipment is all made to be accessible, user-friendly, and affordable.

TotalTemp also offers testing accessories and thermal vacuum systems (TVAC) for efficient space simulation testing.

TotalTemp thermal testing equipment is backed by their dedication to customer service with a two-year warranty for most standard items. TotalTemp takes pride in seeing its customers Success. In conclusion, when putting your space-bound or terrestrial products through rigorous tests, TotalTemp is the solution. You will know you have done your best to ensure the safety and quality of your product. TotalTemp offers many options for thermal test equipment, if you did not see your specific requirements represented in this article feel free to contact us with inquiries and we would be happy to work with you.

Cascade Temperature Algorithm Demonstrates Thermal Testing Goals Reached

Cascade Temperature Algorithm Demonstrates Thermal Testing Goals Reached Faster with the Potential of Differential

Having a specific requirement to test a product to a given temperature profile, how does one show that the actual temperature requirements are being achieved?

Many times, there are parts of a device to be tested that have different heat capacities and also possible active load heat sources.  A single-point temperature control algorithm can have trouble effectively dealing with these variables. Additionally, while it may be tempting to say that a temperature setpoint has been achieved when the numbers on the display panel reach the desired value. – Without diving into the mathematics, being aware of a couple of the basic aspects of heat transfer help understand the problems at hand and achieve the best results:

1) Heat transfers more effectively when the heat source has a greater difference from the point of interest.

2) Convection heat transfer works a lot better when there is plenty of airflows. Truth is, many inexpensive temperature chambers have very low airflow. Air achieves the needed temperature fairly quickly but devices in the airflow, especially if they have any substantial mass or are in the shadow so to speak of another part will take a long time to reach the required temperature.

3) Heat transfer by conduction will always be faster.

Many of the better modern temperature controllers now have the built-in capability to read two or more temperature probes. When you can identify a specific location in the part that is of special interest or proven to be a representative point that can be used to indicate that the temperature setpoint has been achieved, then Synergy Nano’s easy to use advanced temperature control algorithm can be used to improve the process as follows:

1) Allow temperature overshoot within specified limits to get the device to temperature more quickly (greater Temperature differential).

2) Verify when the temperature has been achieved removing unnecessary wait times.

3) Compensate for effects of active heat load, gradients, and latency in the device.

4) Provide recorded proof that proper testing has been done.

 

Advanced temperature control algorithms, now commonplace with better temperature controllers allow precise control of the Chamber or Thermal Platform temperature in order to get any specific location within the controlled zone to the required temperature. Active heat loads or areas that are somewhat thermally isolated from the heating/cooling source are also easily dealt with.  Direct access to a network printer or PDF makes a record of the completion of the temperature test as required without tedious data formatting.

Parameter setting for DUT Temperature Control

As an additional step for improving thermal testing productivity, our dual-mode Hybrid Benchtop Temperature Chamber allows faster and more effective thermal testing of devices regardless of different heat capacity and active loads.  It is simply a temperature chamber with both a thermal platform on the floor and a convection chamber. The Synergy Nano multi-zone temperature controller easily manages the temperature profile and reporting of results.

Hybrid Benchtop Temperature chambers

With this combination, customers report test times are actually cut in half.

Talk to the thermal experts at TotalTemp to find the best solution for your thermal testing needs.

What is the Best Way to Accomplish Appropriate Thermal Test on an Electronic Device?

What is the Best Way to Accomplish Appropriate Thermal Test on an Electronic Device?

Why are Thermal Platforms a good alternative to traditional convection temperature chambers?

There are many reasons thermal testing on products is required.

Primarily to verify that the product will work properly in the environment (thermal and otherwise) that it is intended to perform. Sometimes, also to discover end-of-life issues for products, maximize performance or to weed out early failures that might result in product failures

For reasons primarily of simplicity and ease of use, the most widely employed method of forcing products to temperatures for thermal testing is a (convection based) temperature chamber.

According to laws of Thermodynamics, heat transfer (in and out of a product) is accomplished through one or more of the three following methods.  Conduction, convection and radiation.

Convection, as in a standard temperature chamber, while considerably less effective is often used exclusively for the testing of thermal environmental testing.  Technically speaking the heat transfer method is described as forced-convection or Advection (see equations there) where heat is transferred by circulating air past the source of heat and subsequently past the device under test.  Employing a temperature controller sensing the air temperature with a setpoint of the desired temperature, temperature stability at various points can be achieved.

For completeness, Radiation should be mentioned as well.  For most environmental testing applications other than thermal vacuum where convection or physical contact is not possible radiation is not the best choice. Temperature control by radiation is not as easily managed.

The typical scheme of thermal test by convection works well enough for many applications but some of the limitations of chambers are as follows:

  1. Additional instrumentation is required to sense the product temperature if you really want to be sure if-and-when the device reached the required temperature.
  2. Heat transfer via convection is much slower than heat transfer by conduction (see equations there) resulting in extended test times to assure actual device temperature.
  3. Active loads are less readily managed with convection, again resulting in uncertainty of actual device temperatures
  4. Benchtop chambers are often larger than needed for the specific application resulting in cascading inefficiencies of time, lab space, and utilities.

Thermal Platforms as an alternative to chambers brings fast test times and efficiency of lab provisions (space, HVAC load, maintenance, electricity, cryogenic fluids when required).  Platforms with advanced temperature algorithms can achieve temperatures quickly and efficiently by monitoring both the platform and device temperatures.

Thermal platforms have issues to be considered as well.  First of all, for the promised great improvement in heat transfer, good thermal contact is required.  Many electronic devices either already have a flat conductive surface or can be readily fixtured to provide a good thermal path to the device.  If that is not the case, a traditional convection temperature chamber or Hybrid Benchtop Chamber; that is one that combines the benefits of convection and convection to achieve greater performance may be in order.

Significant additional improvements of the processes of thermal test are achieved through proper application of easy to use automation features.  Advanced features such as control algorithms that can directly read the device temperature have been available for many years but are now made easier to implement with modern temperature controllers like the Synergy Nano controller.

Ease of use from a high quality instrument such as this allows numerous advantages including:

  • Logging to internal files, with multipoint sensors available
  • Log files can be exported to office software or printed directly to a network connected printer
  • Remote control via serial, Ethernet, FTP or optional GPIB with industry standard LabVIEW and other drivers included
  • Easy to use local programmability to make flexible ramp and dwell profiles that can be saved and copied.
  • Flexible alarms and notifications can be easily established to flag events, out of bounds condition or completion of test.  Email, text messages or local alarm notifications or actions
  • Selectable display can show multiple readouts, basic graphing and even control of two separate thermal zones

 

TotalTemp is happy help you find the best solution for your thermal testing requirements with helpful knowledgeable support staff.

Thermal Testing Optimized

Thermal Testing Optimized

It is well known that test and evaluation of production items is a very important part of producing quality products.

The consequences of a lack of quality are unfortunately well known but covering the bases with appropriate testing can be quite time-consuming and expensive and easily run into the weeds of under testing, over-testing, or testing the wrong condition.  The tendency to an error on the side of safety is generally accepted but the flip side of thorough testing can be spending too much time and money testing or literally testing a product to death.

Equally important to understanding the electronic parameters and functions under various electrical conditions which need to be verified is at least a very basic understanding of thermal testing.

A high percentage of failures in electronics are ultimately due to thermal issues.

Subjects for other conversations relating to thermal failures include microscopic cracking, electromigration, the thermal runaway of parameters, or melting of materials.  Many electrolytic capacitors have been shown to dry out and fail more quickly at higher temperatures, critical connections can corrode or otherwise deteriorate enough to cause failure. General expansion and contraction along with the associated moisture cycling are often at the root of many failures.

Three ways

As we learned from an engineering background, the three ways temperature can be changed are by conduction, convection, and radiation.  In that order, they are generally most effective in use for the thermal tests.  Without a big dive into the math and logic behind the statement, conduction is the most effective heat transfer method. Surprisingly, convection, such as in employed in a temperature chamber is far more widely used. As I understand it the main reasons for that disparity are:

1) Heat transfer by conduction requires intimate contact between the heating and cooling equipment (thermal platform) and the device.  Fortunately, many device packages for microwave and other power equipment come in a package with a flat thermally conductive surface. Additionally, many other parts can readily have a machined fixture to provide the needed surface contact.

2) The acknowledgment and the ability to cope with the fact there is always some thermal gradient between the temperature driving the equipment and the furthest part from the driving point that needs to be conditioned.

3) Thinking “That is just the way it is done or one size fits all”. Truly, not all items are compatible with a thermal platform however, with a little prior planning work many parts can readily be more effectively tested on a thermal platform or in some cases even using two or more thermal platforms.

Getting the job done

Convection heat transfer can in cases rival conductive heat transfer effectiveness.  High airflow is important to heat transfer just with air, just as the clamping force is important to conductive heat transfer.  While good airflow is needed for heat transfer, it also comes at a cost. Air friction from high-volume blowers is a surprisingly large source of unintended heating and other losses.  It is often seen that temperature chambers designed to maximize heat transfer and minimize test time produce a surprising amount of heat from air friction.  For example, a high-performance chamber with strong airflow to maximize heat transfer can be seen to cause the chamber temperature to climb from ambient to over 100°C without any other heat added to the system.  Of course, if you are only going that hot, the additional heat from air friction can actually be a benefit.  Fighting that heating with a refrigeration compressor system definitely requires a careful recalculation of this heating contribution to achieve expected cooling results not to mention this also adds more heat to the room, eventually adding to the air conditioning load of the lab room.  For many applications, a temperature chamber with mechanical refrigeration is a very good choice but before purchasing, we suggest you take time to talk to the professionals at Totaltemp and consider understanding the choices before you buy.

Thermal Vacuum Space Simulation Testing Made Easier

Thermal Vacuum Space Simulation Testing Made Easier

Our space simulation chamber VmSD49-N has been featured in Microwave Journal!

Here is a portion of the article:

“Testing products bound for space is a little different for a few reasons, including the lack of air for heat transfer and general level of criticality, no possible service once deployed plus the general high-stakes nature of the whole endeavor. Taking measured risks for the sake of the advancement of science and technology seems to be a key part of the proposition. Given that, appropriate testing is always important for electronic products, but this is even more true for items that are expected to work in a space environment. “

Read the original article here microwavejournal.com.